drop test ranjan rajoo|Failure mode classifications: (a) bulk; (b) mixed; (c) : mail order The high speed cyclic bend test was found to be able to replicate the failure mode and the performance ranking of the solder joints in the board level drop-shock test, while the .
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Two test methods are used in this study: the board level drop/shock test (BLDT) and the component level ball impact shear test (BIST). Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable .
A high-speed bend tester was developed to perform displacement-controlled bend tests of board assemblies at the high flexing frequencies of drop impact. .Ranjan Rajoo has been with the Institute of Microelectronics (IME), Singapore, for more than 10 years focusing on modeling and characterization tasks. He has set up novel experimental . The high speed cyclic bend test was found to be able to replicate the failure mode and the performance ranking of the solder joints in the board level drop-shock test, while the . The high speed cyclic bend test was found to be able to replicate the failure mode and the performance ranking of the solder joints in the board level drop-shock test, while the .
This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact experienced .
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection . The objective of this study is to obtain experimental failure models governing solder joint failure during drop impact testing of board assemblies. A high-speed bend test was developed to.
Ranjan Rajoo. S. K. W. Seah. [.] C.-L. Yeh. This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions.
In the drop test, the number of drops to failure for packages with SAC101 is also higher than those with SAC 305 and it is similar to the number with eutectic SnPb solder balls. . {X.J. Zhao and Frans Justin Maria Caers and J. W. C. de Vries and Jan Leen Kloosterman and Ee-Hua Wong and Ranjan Rajoo}, journal={2006 8th Electronics Packaging .
View the profiles of professionals named "Rajan Rajoo" on LinkedIn. There are 4 professionals named "Rajan Rajoo", who use LinkedIn to exchange information, ideas, and opportunities.Developed EMWLP also show good board level TC ( 1000 cycles) and drop test reliability results. Integration of thin film passives like inductors and capacitors are also demonstrated on EMWLP platform. Developed thin film passives show a .
DOI: 10.1109/ECTC.2005.1441423 Corpus ID: 37686623; Drop Impact: Fundamentals and Impact Characterisation of Solder Joints @article{Wong2005DropIF, title={Drop Impact: Fundamentals and Impact Characterisation of Solder Joints}, author={Ee-Hua Wong and Ranjan Rajoo and Yiu-Wing Mai and Shaw Kah Chuan Sean and Kuo Tsing Tsai and Lipkong Yap}, . DOI: 10.1109/HDP.2005.251399 Corpus ID: 26430339; Drop Impact Reliability - A Comprehensive Summary @article{Wong2005DropIR, title={Drop Impact Reliability - A Comprehensive Summary}, author={Ee-Hua Wong and Yiu-Wing Mai and S. K. W. Seah and Ranjan Rajoo and Thiam Beng Lim and Chwee Teck Lim and John Everett Field}, .
Ranjan Rajoo; GLOBAL FOUNDRIES. Ranjan is currently a Member of Technical staff , OSAT supply chain management / turnkey engineering with Globalfoundries. Prior to joining he was researcher with A-star Institute of Microelectronics (IME) for 15 years in Microsystem, Design & Simulation task. Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device. IEEE Transactions on Components, Packaging and Manufacturing Technology , 2012; 2 (6 .
The high speed cyclic bend test was found to be able to replicate the failure mode and the performance ranking of the solder joints in the board level drop-shock test, while the ball impact shear .510 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 1, NO. 4, APRIL 2011 Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon vias (TSVs) Xiaowu Zhang, Senior Member, IEEE, Ranjan Rajoo, Cheryl S. Selvanayagam, Chirayarikathuveedu Sankarapillai Premachandran, .This is ensured through a robust Quality Management System and Test Method Validation program. The drop test machine(s) should be subjected to an annual preventative maintenance program. The height of the drop should be confirmed with a calibrated ruler, ideally to an accredited reference standard. The impact surface used in testing should .
Przemyslaw Gromala, Bosch, Chair; Xueren Zhang, AMD, Co-Chair; Luu Nguyen, PSIQuantum, Co-Chair; Ranjan Rajoo, Globalfoundries, master; Shiguo Rao, Marvel, Past Chair
Correlation studies for component level ball impact shear test and board level drop test. July 2008; Microelectronics Reliability 48(7):1069-1078; . Ranjan Rajoo. Ranjan Rajoo. This person is .DOI: 10.1109/IMPACT.2008.4783807 Corpus ID: 9332375; A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test @article{Lai2008ASO, title={A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test}, author={Yi-Shao Lai and Ee-Hua Wong and Ranjan Rajoo and S. K. W. Seah and Cheryl .
Ranjan Rajoo Treasurer [email protected] Ranjan Rajoo Treasurer [email protected]. Aug 18, 2021. ieeesingapore.org . . Senior Manager, Photonic Test Devel. Phone Email. Find more contacts . Join the world's top companies using Zoominfo . 4.4/5 on G2 Crowd . Get Started with ZoomInfo. Sign Up for Free The current drop test standards are adequate for most consumer electronics devices; however, there is always room for improvement. As new materials and technologies are developed, drop test standards will need to be .
As reported in Sections 3 Board level drop-shock test, 4 Board level test method: high speed cyclic bend test that brittle failure in the intermetallic compound (IMC) is rather prevalent for solder joints subjected to high strain rate loadings. . L.C. Tan, and Poh-Leng Eu of Freescale, Chang-Lin Yeh of ASE, Cheryl Sharmani and Ranjan Rajoo of .Drop test simulates two situations: one is improper handling of packages during shipping and transportation, and the other is accidental dropping of unpackaged hand held products. Usually the drop height is based on the weight and the . of Ranjan Rajoo of IME and advice provided by D. Frear of . Freescale. . the way to optimize the drop test performance of a Pb-free BGA assembly is to prolong the crack propagation within the .
This paper presents data obtained from a newly-developed instrument to test the quality of solder interconnections at high strain rate – the ‘micro-impactor’. This shear test of the interconnection at high strain rate mimics the stress experienced by the solder joint when undergoing shock due to drop-impact. Instrumented with a load cell and linear variable .The Drop Test Add-on comprises a wizard to automate the setup of a drop test analysis within an Explicit Dynamics or LS-DYNA analysis system from a geometry file of the object to be dropped. Once the Drop Test Add-on is loaded, you should be able to .Explore HIACC Engineering's Drop Tester for accurate package and product drop testing. Our high-precision Drop Test Equipment, including the Free Fall and Zero Drop Testers, ensures reliable testing for electronics, packaging, and fragile items. Our Vertical and Pneumatic Drop Testers provide adjustable drop heights for versatile testing needs. Perfect for evaluating .
The high speed cyclic bend test was found to be able to replicate the failure mode and the performance ranking of the solder joints in the board level drop-shock test, while the ball impact shear test was found to have poor correlation with the board level drop-shock test.R. Rajoo. 56th Electronic Components and Technology Conference 2006, 2006. download Download free PDF View PDF chevron_right. Drop Impact Test -Mechanics & Physics of Failure. . When the drop test assembly can not be considered as rigid, as in the case of a thin flexible base, then the entire drop test assembly has to be modelled and .Ranjan Rajoo; C.s. Selvanayagam . In order to be able to optimize the drop test performance, it is necessary to have better insight into the crack propagation in the Pb-free solder joints. This .DOI: 10.1109/ECTC.2006.1645852 Corpus ID: 10307844; Failure mechanisms of interconnections in drop impact @article{Seah2006FailureMO, title={Failure mechanisms of interconnections in drop impact}, author={S. K. W. Seah and Ee-Hua Wong and Yiu-Wing Mai and Ranjan Rajoo and Chwee Teck Lim}, journal={56th Electronic Components and Technology Conference .
R. Rajoo studies Hydraulic Engineering, Quality Assurance, and Electrical And Electronic Engineering.R. Rajoo studies Hydraulic Engineering, Quality Assurance, and Electrical And Electronic Engineering.
Ranjan Rajoo
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drop test ranjan rajoo|Failure mode classifications: (a) bulk; (b) mixed; (c)